高頻通訊元件散熱解決方案
Lower thermal resistance
Thermal Stress (Customize) match for InP, GaAs , Si, GaN or SiC Laser /PD/Modulator/SOA Substrade
Good for Al, Au, Cu wire bonding material
AuSn material
Build in resistor for high frequency operate
High frequency application
High Reliability
Thermal Stress (Customize) match for InP, GaAs , Si, GaN or SiC Laser /PD/Modulator/SOA Substrade
Good for Al, Au, Cu wire bonding material
AuSn material
Build in resistor for high frequency operate
High frequency application
High Reliability